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Figure 1.1  The LDM9LP with Mounted Pigtailed LD
and the Cover and Clamshell Removed

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Figure 1.3  Front (Top) and Back (Bottom) Images of the LDM9LP Circuit Board

Features

• Designed for Thorlabs' SM, PM, MM, and DFB Pigtailed Laser Diodes^a (Ø5.6 or Ø9 mm, 3 or 4 Pin)
• Supports A, B, C, D, E, G, and H Pin Configurations
• TEC Element Prolongs LD Life and Stabilizes Output Power & Wavelength
• Clamshell Design Eliminates Thermal Gradients Across Diode
• Bias-T Adapter for RF Modulation of Laser Current >200 kHz

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Figure 1.2  Close Up of Mounted Pigtail
LD in LDM9LP Mount

Thorlabs' LDM9LP is an LD and TEC mount designed for use with our 3- and 4-pin pigtailed diodes^a. The compact housing protects the pigtail from physical damage, while also offering excellent thermal characteristics. When operating a pigtailed laser diode, temperature control is highly recommended to stabilize the laser's power and wavelength, while also prolonging the life of the laser. Typical laser diode mounts rely on contact between the diode and the mount's cold plate for heat transfer. Pigtailed laser diodes are often recessed in the pigtail's housing, offering poor contact with the cold plate of standard laser diode mounts. The LDM9LP, however, is specifically designed for operating pigtailed laser diodes. Its clamshell design reduces thermal gradients across the diode, while its cold block cradles the pigtail housing for excellent contact and heat transfer. Performance can be further improved by using thermal grease around the pigtail package within the clamshell.

The LDM9LP allows the user to quickly and easily install or remove pigtail diodes from the mount. The back of the circuit board contains a jumper for selecting the appropriate pin configuration of the laser diode (see Figure 1.3). The jumper is labeled with the compatible pin codes for easy reference. Before installing the pigtailed LD, ensure that the jumper is set correctly. Additionally, the front for the circuit board is labeled with a pinout for the socket to help orient the laser diode correctly before mounting (see Mounting Instructions tab for more detail).

Two 1/4" through holes can be used for securing the mount to an optical table with 1/4"-20 or M6 cap screws. It is highly recommended prior to mounting the diode that users verify the diode pin configuration to ensure the laser diode drive pin is secured in the correct socket. Both the inside of the cover and the front of the circuit board contain the pinout for the socket.

DB9 connections interface with all of Thorlabs' LD Current Controllers and TEC Controllers. An RF SMA connector allows access to a Bias-T circuit for RF modulation of the laser's drive current (>200 kHz). For modulation below 200 kHz, current should be modulated through the laser diode controller. A remote interlock jack is provided for the connection of safety devices such as shutters and warning signs.

a. Due to the variety of fiber pigtailed laser diode packages offered by other companies, this mount is only designed for use with Thorlabs products. The mount can also be used with our VHG-stabilized pigtailed laser diode without the protective cover installed; this should not affect diode performance. Thorlabs offers a laser diode pigtailing service; please contact Tech Support for details.

Settings for Supported Laser Diode Pin Types

The LDM9LP is compatible with A, B, C, D, E, and G pin configurations. Figure 2.2 illustrates how each pin code should be aligned with the socket on the laser mounting PCB. Two jumper pins, shown in Figure 2.3, also need to be set. Settings are outlined in Tables 2.4 and 2.5. The BYPASS jumper should be set only if the laser is modulated via the LD Driver input.

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Figure 2.2  The pin diagrams above show how the laser diode pins should align with the socket on the laser mounting PCB.

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Figure 2.3  The image shows the locations of the STYLE and BYPASS jumper pins. The STYLE jumper pin needs to be set for the pin style of the laser diode in use. The BYPASS jumper should only be set if the laser is modulated via the LD Driver input. Settings are outlined in Tables 2.4 and 2.5.

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Figure 6.1  LDM9LP Packaging

Smart Pack

• Reduce Weight of Packaging Materials
• Increase Usage of Recyclable Packing Materials
• Improve Packing Integrity
• Decrease Shipping Costs

Thorlabs' Smart Pack Initiative is aimed at waste minimization while still maintaining adequate protection for our products. By eliminating any unnecessary packaging, implementing packaging design changes, and utilizing eco-friendly packaging materials for our customers when possible, this initiative seeks to improve the environmental impact of our product packaging. Products listed above are now shipped in re-engineered packaging that minimizes the weight and the use of non-recyclable materials.^b As we move through our product line, we will indicate re-engineered packages with our Smart Pack logo.

• Travel-based emissions reduction calculations are estimated based on the total weight reduction of packaging materials used for all of 2013’s product sales, traveling 1,000 miles on an airplane, to provide general understanding of the impact of packaging material reduction. Calculations were made using the EPA’s shipping emissions values for different modes of transport.
• Some Smart Pack products may show a negative weight reduction percentage as the substitution of greener packaging materials, such as the Greenwrap, at times slightly increases the weight of the product packaging.